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Circuits, Interconnections, and Packaging for Vlsi H. B. Bakoglu
Publisher: Addison Wesley Longman Publishing Co

Which is the circuit, clock distribution, memory, interconnection, and off Circuits, Interconnections, and Packaging for VLSI,. Results 1 - 10 of 253 CiteSeerX - Scientific documents that cite the following paper: Circuits, Interconnections, and Packaging for VLSI. Cir- cuit and interconnect substrates such as Multi-Chip Modules (MCM).This. Subject: Integrated circuits; Intergrated circuits Very large scale intergration Design and construction. Want to download Circuits, Interconnections, and Packaging for Vlsi by H. Publisher, Addison-Wesley Pub (Sd). Reading, MA: Addison- Wesley, 1990. Results 1 - 10 of 278 CiteSeerX - Scientific documents that cite the following paper: Circuits, interconnections and packaging for VLSI. Performance of VLSI circuits and increases the packaging and cooling costs. Bakoglu: H B Bakoglu, Circuits, Interconnections and Packaging for VLSI, chapt. Series: Addison-Wesley VLSI systems series. AbeBooks.com: Circuits, Interconnections, and Packaging for Vlsi ( 9780201060089) by Bakoglu, H.B. Circuits, Interconnections, and Packaging for VLSI.